What To Do About Electrostatic Discharge In Chips
Ғылым және технология
Electrostatic discharge is a well-understood phenomenon, but it’s becoming more difficult to plan for as single chips are replaced by multiple chips or chiplets in a package, and as the density of components continues to increase with each new node. In both cases, the probability for failure increases unless these sudden shocks are addressed in the design. Dermott Lynch, director of product marketing for Synopsys’ EDA Group, talks with Semiconductor Engineering about why the human body or charged device models are no longer sufficient protection, why stacking chips in a package increases the risk of a catastrophic event, and how to identify potential design violations that can worsen the impact of ESD.
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Not enough videos and documentation explaining these techniques . Thank you for uploading
I was taught to be almost paranoid with ESDs when handling chips and boards, but hearing how much engineering goes into the indented discharge paths goes, explain why people being more casual with their handling still are able to build working devices.
Very informative!