In this episode of the Altium OnTrack Podcast, host Zach Peterson sits down with Jan Vardaman, president and founder of TechSearch International. With decades of experience in semiconductor packaging, Jan shares her expert insights into the global semiconductor industry, focusing on the shift away from Asia for advanced manufacturing and the critical need for an integrated supply chain in the U.S.
Key topics covered include:
⁍ The transition of high-end semiconductor packaging from Asia to other regions like Taiwan and Korea.
⁍ The impact of new facilities in Malaysia on the global supply chain.
⁍ The role and challenges of the National Advanced Packaging Manufacturing program in the U.S.
⁍ Detailed discussions on substrate manufacturing and advanced assembly operations outside China.
⁍ The significance of workforce development in sustaining local manufacturing initiatives.
⁍ Future trends and strategies for semiconductor fabrication and assembly in North America.
This episode not only highlights the technological and industrial shifts in semiconductor packaging but also discusses the economic and policy dimensions affecting the sector.
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💡 Learn More about TechSearch International: www.techsearchinc.com/
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0:00 Intro
0:44 About Jan Vardaman & TechSearch International
1:57 Jan's IPC US Electronics Manufacturing Infrastructure Report
5:27 Lopsided Market Share
7:21 Educational Changes Are Needed
9:21 NAPMP PCB Manufacturing Funding Opportunities
12:33 Getting the Demand Back
13:41 China is a Separate Conversation
16:14 NAPMP American Substrate Funding Opportunity
18:53 Vendor Lock Culture
19:51 How the NAPMP Funding Opportunity is Different
23:51 European Substrate Production
27:29 Small Business Focus
28:49 Emphasis on United States Ecosystem