This video describes and demonstrates the cold component removal process. Underfilled or high density boards are in many cases very difficult to rework as the underfill or neighboring components damage neighboring areas of the PCB. This could be due to underfill "pushing" solder to other parts of the PCB. On high density boards heat from the desoldering process can damage neighboring components or the board itself. BEST has a tool to eliminate heat and increase the yield of the PCB rework process.