Wedge Bonding on Chip
Ғылым және технология
TPT Wirebonder HB16 - Wedge-Wedge Bonding.
Semiautomatic Loop Shape.
For more information visit: www.tpt-wirebonder.com/applications/#wedge-bonding
TPT Wirebonder HB16 - Wedge-Wedge Bonding.
Semiautomatic Loop Shape.
For more information visit: www.tpt-wirebonder.com/applications/#wedge-bonding
Пікірлер: 17
Glorious 240p. Good ol' KZreads. ;-)
@TPTWirebonders
2 ай бұрын
Thank you @K.D.Fischer_HEPHY 🙂
Amazing.
@TPTWirebonders
Жыл бұрын
Thank you Mário 🙂
@Mario-ye9pt
Жыл бұрын
@@TPTWirebonders
may i know , how to reduce wire tail on bump?
@TPTWirebonders
Жыл бұрын
Dear Jarren, you can influence your tail length by changing your loop design. Feel free to contact our technicians via service@tpt.de.
what regime was used here? Table tear or clamp feed? thanks!
@TPTWirebonders
2 жыл бұрын
Hi Ilya 🙂 in this clip we used table tear, but the machine can also perform clamp feed.
@ilyatitkov4669
2 жыл бұрын
@@TPTWirebonders Thank you! it is actually difficult to find the proper parameters for the 17um wedge tool. Hope the "table tear" will help. Thanks!
@ilyatitkov4669
2 жыл бұрын
@@TPTWirebonders Hi, what were the values of "feed" and "tail" parameters here?
@TPTWirebonders
2 жыл бұрын
Hi Ilya, this video was shot with our HB16 semiautomatic wire bonder. we probably used standard values for this wedge: 50µm.
@ilyatitkov4669
2 жыл бұрын
@@TPTWirebonders thanks a lot!
Why Gold wire
@TPTWirebonders
2 жыл бұрын
Gold wire is very common in wire bonding, but also aluminum, copper or other materials are possible.
contact between chip and substrate... omg
@TPTWirebonders
2 жыл бұрын
It is ultrasonic wire bonding, thank you for watching!