Power Electronics - Thermal Considerations
Simplified thermal analysis of electronic devices based on the parameters from the datasheet is presented. An example is provide to help design heat sinking requirements.
Simplified thermal analysis of electronic devices based on the parameters from the datasheet is presented. An example is provide to help design heat sinking requirements.
Пікірлер: 15
Excellent presentation! Hope upload more vids!!
@powerelectronicswithdr.k1017
3 жыл бұрын
Yuchen, thank you for watching. -Dr. K
Very informative 👌
Awesome lecture! thanks a lot Dr.K.
@powerelectronicswithdr.k1017
3 жыл бұрын
You are welcome. Hope your design works well. -Dr. K
Hey Dr. K! Loved the video. Is there a textbook that talks about these considerations that you would suggest. Do not need detail, just a good source about power electronics and thermal considerations.
Nice. However, for a more accurate analysis, the heatsink should be represented by a series connection of a resistor (K/W) and a capacitor for thermal capacitance (J/K).
@powerelectronicswithdr.k1017
2 жыл бұрын
EB1000, yes, absolutely. Also thermal capacitance should be added to the package as well. As mentioned in the intro this is a static model and a more complicated model would/should include the thermal capacitance. Thanks for watching. -Dr. K
Thank you
Sir i have one question, why my İRF 530 N mosfet heat up when i gave 10volt between gate and source? The Output drain /source is not connect . I measure 40°C directly on the case.
Great video but if I may suggest a small correction, your thermal resistive circuit at @10:00, the 3rd resistance of R theta to heat sink is incorrect. It should be R case to ambiance. This way you can then calculate R theta to Ambiance by subtracting R1 (1.15) and R2 (0.5) giving you the required thermal resistance of the heat sink to "dissipate generate heat into the ambiance"
@powerelectronicswithdr.k1017
10 ай бұрын
Actually, it should be "Film to Ambient" as the example assumes a thermal conductive film is placed between the case and the heatsink to improve thermal conductivity. The heatsink then has thermal resistance between the film and the ambient. Notice the film's thermal resistance is very low and could probably be ignored or included with the heatsink. The resulting analysis would just be the case-ambient resistance, which I am calling the heatsink. Typically, one would first use the junction-ambient thermal resistance found in the datasheet to check if a heatsink is even required. Sorry about any confusion. Thanks for watching. -Dr. K
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Sir it's very good Work 👍, what's the Song name of the beginning in your Video?
@powerelectronicswithdr.k1017
3 жыл бұрын
Serdar, thank you. The bumper music is "Drive In" by Track Tribe kzread.info/dash/bejne/daidscSulbzFis4.html Thanks for watching. -Dr. K