In recent years, the quality level required for diamond dies has risen along with an improvement in the precision of wire materials
such as semiconductor bonding wires and medical wires.
Requirements are increasing for wire characteristics, particularly wear resistance and properties to maintain roundness and wire surface roughness. UKO ND dies could meet the needs.
Several drawing die materials may be available depending on drawing needs. ND dies are an excellent option for manufacturing fine and ultra-fine wires, such as gold wire, and silver wire.
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