CEA-Leti offers state-of-the-art technology bricks to enable 3D high performance applications: computing, telecommunication, photonics, RF and heterogeneous technologies.
From design to fabrication and electrical characterization, CEA-Leti offers various hybrid bonding solutions using full 300&200mm fabrication lines including Known Good Dies:
👉 Wafer-to-wafer and die-to-wafer bonding technologies
👉 Multi-layer hybrid bonding techniques with fine connection pitches ( below 1μm) to support various technologies with high bandwidth
👉 Merging bonding techniques and modules for next generation of ultra-fine die alignment ( below 200nm)
#HybridBonding #3D #packaging
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