00:00 PCB Layers in KiCad
00:24 List of KiCad Layers
01:04 Copper Layer
05:15 Adhesive Layer
06:39 Solder Paste Layer
10:39 Silk-Screen Layer
15:16 Solder Mask layer
17:05 User Drawing layer
18:37 User Comments
19:37 User Eco1 & Eco2
20:18 Edge Cut layer
22:31 Margin Layer
24:19 Courtyard Layer
26:45 Fabrication Layer
28:18 User Layer
29:47 Summary Of KiCad Layers
Understanding the PCB layers in KiCad is crucial for designing printed circuit boards effectively. KiCad provides several layers, each serving a specific purpose in the PCB design process. Here's an overview of the main PCB layers in KiCad and their functions:
1. Top Copper Layer (F.Cu):
- Represents the top layer of copper traces and pads on the PCB.
- Used for routing signal traces and placing surface-mount components.
2. Bottom Copper Layer (B.Cu):
- Similar to the top copper layer but represents the bottom layer of copper traces and pads.
- Used for routing signal traces and placing surface-mount components on the bottom side of the PCB.
3. Silkscreen Layers (F.SilkS, B.SilkS):
- Used for adding human-readable markings on the PCB, such as component outlines, reference designators, and logos.
- Helps with component placement and assembly.
4. Solder Mask Layers (F.Mask, B.Mask):
- Indicates areas where solder mask should be applied over the copper traces and pads to prevent solder bridges during assembly.
- Protects exposed copper areas and ensures proper soldering by preventing shorts between adjacent traces or pads.
5. Edge Cuts Layer (Edge.Cuts):
- Defines the outline of the PCB, including its shape and dimensions.
- Specifies the physical boundaries of the board and determines its final form factor.
6. Drill Guide (Drill):
- Contains the drill hole locations for mounting components, through-hole vias, and other mechanical features.
- Provides instructions for the PCB manufacturer on where to drill holes in the board.
7. Courtyard Layer (Cmts.User):
- Defines the recommended placement area for components, typically larger than the actual component outline.
- Helps ensure proper spacing and clearance between components for assembly and soldering.
8. Assembly Layer (F.Fab, B.Fab):
- Contains assembly-related information such as component outlines, polarity markings, and assembly notes.
- Aids in the assembly process by providing visual guidance for component placement and orientation.
Understanding and effectively utilizing these PCB layers in KiCad is essential for creating well-designed and manufacturable printed circuit boards. Each layer serves a specific purpose and contributes to the overall functionality and reliability of the final PCB design.